高薪工作機會

工作內容：In this role, you will be responsible to develop new hardware/chip architectures, technologies, designs and methodologies for Mediatek’s silicon solution to address advanced chiplet architectures in 2D, 2.5D and 3D configurations. Mediatek provides the challenging and exciting technical position where you will have the opportunities to explore and define the next generation silicon solutions. Major Responsibilities: • Develop new product and chip architectures, analyze the key metrics such as power, performance, area, scalability and reusability for chiplet • Develop new methodologies for chiplet design and mass production flow

工作內容：1. Modem product planning, marketing and customer project design-in 2. Operator engagement and requirement analysis 3. Modem development project coordination and planning

工作內容：1. Collection mobile markets trend, new and innovation technologies transform to technical marketing opportunities 2. Prioritization of product requirements and feature requests to ensure key customer plan 3. Translates customer feedback and market environment variety into potential changes for product roadmap 4. Driving an ecosystem of AI third-party software algorithm to leverage the MediaTek APU platform

工作內容：- Develop robust 3DIC PDN considering PDN impacts - Build and analyze 3DIC IR results and propose solutions - Define area-efficient stacking possibilities, robust PG structure for different IP styles - Provide quick assessment to IR severity and improved approaches - Explore EDA tool new features and introduce to project team

工作內容：1 Develop the IR signoff criterion for leading process node and 3DIC. 2 Maintain the IR signoff criterion ,provide issue solving and consultant for projects on abnormal/unfixable IR violation 3 Develop new IR signoff methodology to be applied during chip synthesis/APR/STA/IR . 4 SPICE correlation for new IR signoff criterion 5 Regression test for every signoff methodology by IR results

工作內容：1. 10G/5G/2.5G Ethernet MAC/ BASET PHY開發 2. 訊號處理與通訊演算法實現 3. 系統整合與驗證

工作內容：1. Collection mobile markets trend, new and innovation technologies transform to technical marketing opportunities 2. Prioritization of product requirements and feature requests to ensure key customer plan 3. Translates customer feedback and market environment variety into potential changes for product roadmap 4. Driving an ecosystem of AI third-party software algorithm to leverage the MediaTek APU platform

工作內容：1. 新封裝供應商稽核及認證 2. 封裝供應商品質及可靠度管理 (品質異常事件處理, 變更管理, 例行性稽核, 評比等) 3. 新產品及技術導入品質及可靠度管理 4. 封裝供應商品質改善專案

工作內容：IO電路和ESD防護設計, 工作內容包含 (1) ESD/LUP防護設計 (2) IC ESD/LUP防護檢查 (3) 有EOS/Surge/System ESD 設計經驗尤佳

工作內容：• 帶領與整合類比IP團隊與技術, 開發新的SOC或ASIC產品 • You will work as part of analog project management team and work closely with SoC Integration teams responsible for enabling on-time silicon to meet product schedules. • Multi-task skills will be key to lead several tasks of project at a time. • Track and drive resolution of technical issues between multi-functional teams including Design, Verification, Validation, Process Technology, Packaging, Quality and Reliability, System Hardware and Application. • Convert data into a clear story to communicate to partners and organizations at all levels. • Pull together regular project status presentations for executive leadership review. • Identify risks, develop mitigation strategies and facilitate conflict resolution. • Collaborate with software/hardware teams for silicon validation of analog IPs • Deliver highly focused and detailed issue reporting, bug tracking and communication of risks and status